ABOUT US

DSG Technologies offers leading edge solutions for advanced thermal processing and thin-film deposition utilizing Micro-Mode Microwave (M3) heating technology in front-end integrated circuit fabrication. Our innovative patented reactor Axom-200/300) is designed to address the semiconductor industry's demand for uniform low temperature processing. Our technology and expertise are critical enablers in the transition to 300 mm wafers, reduced circuit geometries and new materials such as Cu, Low-k and polyimide encapsulation.


Incorporated: November 2004

Website Address: www.dsgtek.com

Products: DSG Technologies provides manufacturing equipment for thermal processing

Service and Support: Located throughout the United States, Europe, and Asia

Worldwide Headquarters:
135 E. Main Avenue, Suite 170
Morgan Hill, California 95037
408-776-2890 phone
408-776-2893 fax