AXOM-200/300

PRODUCT DESCRIPTION

Low temperature thermal processing has become critical in leading-edge device manufacturing. DSG Technologies is the leader in batch microwave heating technology.

Our proprietary M3 batch cold wall reaction chamber and unique temperature control algorithms guarantee superior results on the silicon wafer with unparalleled temperature uniformity, repeatability, ramp rates, and cooling rates. Our system offers the lowest total cost of ownership (TCO) by providing our customers unsurpassed productivity and low maintenance intensive downtime.

APPLICATIONS

• Low Temperature Ozone Oxidation
• Cu Annealing
• Polyimide/BCB Cure
• High-k Annealing
• Low-k Dielectrics Annealing
• Ultra Low Temperature LPCVD (Nitride)
• MEMS Annealing

KEY BENEFITS & SPECIFICATIONS

• Dual Chamber Configuration, provide 2 Process Chambers, loaded by a Single Wafer Robot
• Sequential Processing allowing Wafers to be transfered from one Process Chamber to the other
• Systems can be placed side-by-side
• Loadport can handle up to 4 Cassettes
• Vacuum Compatible and Ambient Control
  -low O2 (<5ppm)
  -H2 or forming gas
• Operating Temperature 50 ~ 550 °C
• Cold Wall System
• Excellent Process Uniformity ,1%
• Excellent Thermal Repeatability <1 °C (Range)

HIGH PRODUCTIVITY WITH REDUCED CYCLE TIME