TECHNOLOGY
Micro-Mode Microwave (M3) is the next generation leading edge heating technology which will replace
resistance heating (IR) furnaces. Microwave heating of silicon wafers used in the
fabrication of semiconductor devices is
volumetric, throughout the material, as compared with external via thermal
transfer in resistance heaters (furnaces). The system can process a batch
of 50 wafers simultaneously and provides excellent temperature
repeatability (<1 °C across wafer), ramp and cool down rates in excess
of 5 °C/sec all at the lowest total cost of ownership (TCO) in the industry.
MICROWAVE HEATING
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Electromagnetic Waves Oscillate Molecules to Uniformly Heat the Entire Volume of the Wafer from Within (Volumetric Heating)
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Uniform Wafer Heating
· Accurate wafer temperature control
· < 1 °C / wafer
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Superior Transient Temperature Control
· Fast energy transfer (speed of light)
· > 5 °C / sec ramp rates
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 : MICRO-MODE MICROWAVE
- M3 Technology Provides Precise Distribution of Microwave Energy
· Utilizing the latest microwave technology
· Control algorithms specifically tailored for batch wafer thermal treatment
· Reactor designed to minimize mode formations
- Benign Process to Semiconductors
· No change to device parameters or dopants
· Arcing and thermal runaway is eliminated
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