DSG Technologies has pioneered next-generation Microwave Annealing (MWA) for advanced semiconductor manufacturing and 3D integration. Unlike conventional thermal-transfer processes such as RTP, DSG’s technology enables selective, volumetric microwave interaction with silicon wafers, thin films, and critical material interfaces while reducing the overall thermal budget.

Through advanced electromagnetic modeling, chamber development, and proprietary field control, DSG has completed the critical scale-up development required for uniform MWA processing across 300mm wafers—establishing a practical pathway from application development to manufacturing integration.

DSG’s single-wafer and batch platforms provide precise temperature control, excellent repeatability, and rapid ramp and cooling capabilities. Built on more than two decades of industry and research collaboration, DSG’s MWA technology is engineered for the demanding material and process requirements of next-generation semiconductor devices.