DSG Technologies has pioneered next-generation Microwave Annealing (MWA) for advanced semiconductor manufacturing, including 3D integration. Our low-temperature annealing process enables selective, volumetric heating of thin films on silicon wafers—unlike conventional thermal transfer methods such as RTP.

The system supports both single-wafer and batch processing, delivering exceptional temperature repeatability with fast ramp and cooldown rates. This results in unmatched process control and the industry’s lowest total cost of ownership (TCO).

With over 15 years of collaboration with leading semiconductor companies, DSG has engineered precise, reliable solutions purpose-built to meet the rigorous demands of next-generation device fabrication.