For more than two decades, DSG Technologies has demonstrated the performance advantages of microwave annealing (MWA) through industry and research collaborations. AXOM™ builds on this experience to address a key industry challenge: scaling MWA technology for uniform processing across 300mm wafers.
Powered by custom microwave technology and DSG’s proprietary process-control architecture, AXOM™ is a flexible application development platform designed to support the transition from research and process validation to pilot-line and high-volume manufacturing integration.
AXOM™ enables controlled, low-thermal-budget processing for applications such as dopant activation, contact and silicide formation, interface treatment, defect reduction, film densification, and mobility enhancement—while minimizing thermal exposure to surrounding temperature-sensitive materials.
Key capabilities include:
Scalable MWA processing for applications targeting 300mm wafers
Custom microwave generation and control
Direct wafer-temperature measurement and closed-loop control
Flexible frequency, power, phase, and process-time adjustment
Low-oxygen process control below 1 ppm
Proprietary cold-wall reaction-chamber technology
Optimized temperature uniformity and process repeatability