The AXOM™  Microwave Anneal (MWA) system is DSG Technologies' solution for low thermal budget processing requirements for advanced technology nodes in semiconductor devices. DSG's unique technology allows for selective activation of dopants in thin films required for FinFet processing, advanced silicide formation and mobility enhancement in conductive thin films while preventing damage to thin film layers sensitive to a high thermal budget.

DSG's AXOM™ platform allows for a variety of applications due to its flexibility with process temperature control offering a wide temperature range from 50 to 1250°C.

AXOM™ features include low O2 control (<1ppm), direct wafer temperature measurement and precise control throughout the anneal cycle.

Our proprietary cold wall reaction chamber and unique temperature control algorithms guarantee superior results with unparalleled temperature uniformity, repeatability, ramp rates, and cooling rates. Our system offers the lowest total cost of ownership (TCO) by providing our customers unsurpassed productivity and low maintenance intensive downtime.