Technical innovation is the foundation of DSG Technologies' success. We have developed a next generation leading edge heating technology: Capacitance Induced Annealing, which will be required for sub 20nm chip manufacturing. Low temperature annealing of thin films on silicon wafers, used in the fabrication of semiconductor devices is both selective and volumetric, throughout the material, as compared with external heating via thermal transfer in IR heaters (e.g. RTP). The system can process up to a batch of 25 wafers simultaneously and provides excellent temperature repeatability, with fast ramp and cool down rates resulting in the lowest total cost of ownership (TCO) in the industry.